Stats Chip Pac

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STATS ChipPAC Ltd. is one of the leading service providers of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. Based in Singapore, The firm has design, research and development, manufacturing or customer support offices in 10 different countries. Its packaging services involves providing leaded, laminate, memory card and wafer level chip-scale packages (CSP), redistribution layers (RDL), integrated passive devices (IPD) and wafer bumping services for wafer level CSPs. STATS ChipPAC Ltd. also offers testing expertise in a broad variety of semiconductors, especially mixed-signal, radio frequency (RF), analog and high-performance digital devices.