Ormet Circuits Inc

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San Diego, CA.-- ( BUSINESS WIRE ) Ormet Circuits, Inc announces a high-melting Pb-free solder alternatives agreement with the Indium Corporation Ormet Circuits, Inc announced the signing of a joint marketing and technical support agreement with Indium Corporation for its patented transient liquid phase sintering assembly materials. The agreement enables Indium Corporation to offer a line of high-temperature, Pb-free ( lead-free ) assembly materials that addresses the requirements of many power semiconductor and semiconductor packaging applications. When Pb-free is a requirement, the only suitable high-temperature solder that exists is the AuSn eutectic alloy. These transient liquid phase sintering ( TLPS ) materials, which offer an alternative technology to solder, provide many of the assembly process advantages of a low-melting Pb-free solder combined with high temperature joint stability. Indium Corporation Global Product Manager Dr. Andy Mackie said, "Ormet is leveraging Indium Corporations global sales and technical support capabilities to offer these products into the electronics assembly, passive component assembly, and semiconductor assembly markets. The Indium Corporation is leveraging Ormet's unique materials set. This combination ultimately benefits our customers and the marketplace. Ormet is gaining a valuable sales channel partner to introduce and deliver the next generation of assembly and interconnect materials to the electronics assembly industry, said James Haley Ormet's Vice President of Marketing and sales. Headquartered in San Diego, CA, Ormet Circuits, Inc was incorporated in 2003 to manufacture and market conductive pastes and inks for the printed circuit board fabrication and microelectronics industries. Ormet conductive materials find wide use in many electronic applications from radar antennas to semiconductor packages, complex circuit boards, and electronic components and assemblies. Indium Corporation is a premiere materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, performs, and fluxes ; brazes ; sputter targets ; indium, gallium, and germanium chemicals and sourcing ; and Reactive NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Ormet Circuits, Inc please visit www.ormetcircuits.com or email support@ormetcircuits.net. San Diego, CA.-- ( BUSINESS WIRE ) Ormet Circuits Inc has released its next RoHS compliant Z-Interconnect paste for use in multilayer printed wiring board structures. Ormet's Z interconnect pastes are used in Military, Telecommunications and network server boards, Personal Digital Assistants, RF assemblies and smart phones. Ormet 701 material provides designers and fabricators a powerful material and process solution enabling current PWB manufacturing processes to meet Original Equipment Manufacturers ( OEM ) high-density designs with higher yield and reliability. The manufacturing improvements permitted by Ormet's materials promote limited lamination cyclesshortened production time, andreduced overall PWB costs. The Ormet paste extends the fabricators' toolbox for placing micro-vias in any layer at any location within the PWB. Ormet 701 is a transient liquid-phase sintered ( TLPS ) paste that is a composite metal and polymerbased material that undergoes dynamic structural changes during low-temperature heat treatment. During processing, a continuous metal network is created between the paste's metal particles and the adjoining metal layers in the multilayer substrate. The resulting metal network is highly electrically and thermally conductive and exhibits stable properties above 265 C.